Answer
Apr 18, 2025 - 11:57 AM
In general, wafer paper is easy to cut through with a sharp knife.
Keep in mind that the more watery the substrate is underneath the base of the wafer on the cake, the softer the wafer paper will become and thus easier to cut. It all depends on the icing of the cake underneath the wafer paper.
Keep in mind that the more watery the substrate is underneath the base of the wafer on the cake, the softer the wafer paper will become and thus easier to cut. It all depends on the icing of the cake underneath the wafer paper.
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